Semiconductor giant AMD has committed more than $10 billion to its industrial ecosystem in Taiwan. The substantial investment focuses on expanding strategic manufacturing partnerships and scaling advanced component packaging capabilities to satisfy global demand for artificial intelligence infrastructure.
The capital injection will primarily fund the industrialisation of next-generation wafer-based 2.5D bridge interconnect technology, known as Elevated Fanout Bridge (EFB). Working alongside prominent Taiwanese chip assembly firms ASE and SPIL, AMD intends to deploy this architecture to boost interconnect bandwidth and increase energy efficiency. The technology will directly support AMD’s upcoming 6th Generation EPYC central processing units, codenamed Venice, enabling data centres to run intensive workloads within strict power constraints.
As part of the regional expansion, AMD has also qualified the industry’s first panel-based 2.5D EFB interconnect in partnership with PTI. This process innovation allows for high-bandwidth component assembly at a significantly larger physical scale, reducing manufacturing costs for hyperscale cloud providers. Supplementary components and manufacturing services will be supplied by local partners Unimicron, Nan Ya PCB, Kinsus and AIC to secure supply chain resilience.
The manufacturing advancements are timed to feed directly into the high-volume production of the AMD Helios rack-scale platform, which remains on schedule for multi-gigawatt data centre deployments starting in the second half of 2026. Production systems will integrate AMD Instinct MI450X graphics processing units and Venice CPUs alongside the proprietary ROCm open software framework. Engineering firms Sanmina, Wiwynn, Wistron and Inventec have signed on as primary manufacturing partners to assemble and scale the server racks globally.
“As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand,” said Dr. Lisa Su, Chair and CEO, AMD. “By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems.”
Corporate supply chain executives across the partner network welcomed the investment. Steven Tsai, Senior Vice President of Sales at ASE, stated: “Our collaboration with AMD on Elevated Fanout Bridge technology represents a significant step forward in scaling advanced packaging for high-volume applications. By working together to industrialize EFB, we are enabling greater performance, efficiency and flexibility for next-generation data center platforms.”
“SPIL is proud to partner with AMD to bring innovative packaging solutions like EFB to market,” said John Yu, Vice President of Sales at SPIL. “These technologies are helping expand the reach of advanced packaging into new applications while supporting the rapid growth of AI infrastructure.”
PTI Chairman DK Tsai added: “Through our work with AMD on panel-based EFB, we are delivering new levels of scalability and cost efficiency for advanced packaging. This collaboration enables faster time-to-market and supports the high-volume production requirements of next-generation processors like ‘Venice.’”
Highlighting the manufacturing side of the project, Jure Sola, Chairman and CEO of Sanmina Corporation, said: “Sanmina is proud to partner with AMD to deliver next-generation AI infrastructure at scale. Our work together on AMD Helios manufacturing highlights the strength of the ecosystem and our shared commitment to delivering high-performance, reliable solutions to customers worldwide.”
“Wiwynn’s collaboration with AMD on the Helios platform reflects our commitment to delivering fully integrated, rack-scale AI infrastructure,” said William Lin, President and CEO of Wiwynn. “Together, we are empowering hyperscalers to deploy AI at scale with the performance, efficiency and reliability the market demands.”
Inventec President Jack Tsai said: “Inventec is pleased to collaborate with AMD on delivering high-performance AI and data center systems. Together, we are enabling customers to deploy powerful, energy-efficient infrastructure to support increasingly complex workloads.”
